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High-performance aliphatic polyamide curing agent designed for ambient and elevated temperature epoxy curing.
Offers excellent flexibility, impact resistance, and adhesion to diverse substrates including steel, concrete, and aluminum.
Low viscosity enables easy handling, good mixing with epoxy resins, and reduced entrapped air in coatings and adhesives.
Provides extended pot life at room temperature while maintaining rapid cure development upon heat activation.
Complies with REACH and is formulated without intentionally added heavy metals or alkylphenol ethoxylates.
High-solids and solvent-free epoxy flooring systems for industrial and commercial facilities.
Structural adhesives for metal-to-metal and composite bonding in transportation and wind energy sectors.
Corrosion-resistant protective coatings for offshore platforms, pipelines, and marine infrastructure.
Electrical encapsulants and potting compounds requiring thermal stability and dielectric integrity.
Repair mortars and grouts where toughness and chemical resistance are critical performance requirements.
| Chemical Type | Aliphatic polyamide |
| Product Form | Liquid |
| Appearance | Amber to brown viscous liquid |
| Primary Applications | Epoxy curing agent for coatings, adhesives, and composites |
| Key Features | Ambient-cure capability, low exotherm, flexible cured film |
| Benefits | Improved substrate wetting, reduced shrinkage, enhanced durability |
| Storage Stability | 12 months in unopened original container at 15–25°C |
| Compatibility | Standard diglycidyl ether of bisphenol-A (DGEBA) and novolac epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
