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Low-viscosity polyamide curing agent enabling excellent flow and wetting in epoxy systems.
Provides balanced pot life and rapid ambient-cure performance for efficient production cycles.
Delivers high flexibility and impact resistance in cured epoxy coatings and adhesives.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Meets stringent VOC regulations with low volatile organic content and no added solvents.
Industrial maintenance coatings for steel infrastructure and offshore assets.
High-performance epoxy flooring systems in commercial and manufacturing facilities.
Structural adhesives for metal-to-metal and composite bonding in transportation equipment.
Repair mortars and grouts requiring fast strength development and chemical resistance.
Electrical encapsulation compounds where flexibility and thermal shock resistance are critical.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Ambient clear to pale yellow viscous liquid |
| Primary Applications | Epoxy coatings, adhesives, mortars, and encapsulants |
| Key Features | Ambient cure, low viscosity, flexible cured film |
| Benefits | Improved application efficiency, reduced mixing time, enhanced toughness |
| Storage Stability | 12 months in original unopened container at 15–25°C |
| Recommended Epoxy Equivalent Ratio (EEW) | 1.0–1.3 equivalents per epoxy equivalent |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
