Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM-172 Epoxy Resin

KUKDO SM-172 Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin from KUKDO’s SM series, offering excellent adhesion, chemical resistance, and mechanical strength. Widely used in composites, coatings, and electrical encapsulation, it features low viscosity, good reactivity with amines/anhydrides, and superior thermal stability. Ideal for demanding industrial applications requiring reliability and consistent curing performance.
  • kukdo sm 172 epoxy resin_47db76a5
  • kukdo sm 172 epoxy resin_47db76a5

Features Of KUKDO SM-172 Epoxy Resin

  1. High reactivity with amine and anhydride hardeners for rapid gelation and short cure cycles.

  2. Excellent adhesion to metals, composites, and cured epoxy substrates.

  3. Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and good wetting of reinforcements.

  4. Superior thermal stability with glass transition temperature (Tg) up to 125°C after full cure.

  5. Low chloride content (< 800 ppm), ensuring compatibility with sensitive electronic encapsulation applications.

Typical Applications Of KUKDO SM-172 Epoxy Resin

  1. Structural adhesives for aerospace and automotive bonding.

  2. Prepreg matrix resin for carbon fiber reinforced composites.

  3. Encapsulation and potting compounds for power electronics and LED modules.

  4. High-performance coatings for corrosion protection on steel and aluminum substrates.

  5. Electrical laminates in printed circuit board (PCB) base materials.

Specifications Of KUKDO SM-172 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-A (DGEBA)
Product FormLiquid resin
AppearancePale yellow transparent liquid
Epoxy Equivalent Weight (EEW)186–192 g/eq
Viscosity (25°C)12,000–14,000 cP
Softening PointNot applicable (liquid at room temperature)
Chloride Content< 800 ppm
Volatiles Content< 0.3 wt%


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