High reactivity with amine and anhydride hardeners for rapid gelation and short cure cycles.
Excellent adhesion to metals, composites, and cured epoxy substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and good wetting of reinforcements.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chloride content (< 800 ppm), ensuring compatibility with sensitive electronic encapsulation applications.
Structural adhesives for aerospace and automotive bonding.
Prepreg matrix resin for carbon fiber reinforced composites.
Encapsulation and potting compounds for power electronics and LED modules.
High-performance coatings for corrosion protection on steel and aluminum substrates.
Electrical laminates in printed circuit board (PCB) base materials.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Liquid resin |
| Appearance | Pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 186–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | < 800 ppm |
| Volatiles Content | < 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China