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High-purity bisphenol-F based epoxy resin with low chloride content for enhanced electrical insulation.
Excellent thermal stability and glass transition temperature (Tg) suitable for demanding curing profiles.
Low viscosity at elevated temperatures, enabling superior processability in casting, impregnation, and laminating.
Outstanding chemical resistance to alkalis, solvents, and weak acids after full cure.
Consistent molecular weight distribution ensures reproducible reactivity and mechanical performance.
Electrical insulation systems for high-voltage transformers and bushings.
Casting resins for encapsulation of power electronics and LED modules.
Matrix resin in high-performance fiber-reinforced composites for aerospace tooling.
Structural adhesives requiring elevated temperature resistance and dimensional stability.
Prepregs and laminates for printed circuit board (PCB) substrates demanding low ionic contamination.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Off-white to light yellow solid flakes or pellets |
| Appearance | Homogeneous, free-flowing solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Melting Point | 48–52 °C |
| Softening Point | 50–54 °C (ASTM D36) |
| Chloride Content | ≤ 500 ppm |
| Volatiles (150 °C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
