High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy mixing, degassing, and impregnation of fibers or fillers.
Superior mechanical strength and thermal stability after full cure, supporting demanding structural applications.
Low chloride content (< 500 ppm), minimizing corrosion risk in metal-reinforced composites and electronic encapsulants.
Structural adhesives for aerospace and automotive bonding.
Electrical insulation systems in transformers, bushings, and high-voltage encapsulation.
Fiber-reinforced polymer (FRP) composites for wind turbine blades and marine components.
Potting and encapsulation of power electronics and LED modules.
High-performance coatings for chemical-resistant industrial flooring and tank linings.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | < 500 ppm |
| Color (Hazen) | < 30 |
| Softening Point | 12–16°C |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China