Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

LAN-XESS UX 550 Epoxy Curing Agent

LANXESS UX550 is a high-performance aliphatic amine-based epoxy curing agent from the UX Series, engineered for rapid ambient-cure applications requiring excellent chemical resistance, low viscosity, and superior adhesion to diverse substrates including concrete and metals—ideal for industrial flooring, coatings, and composites.
  • lan xess ux 550 epoxy curing agent_3017c72b
  • lan xess ux 550 epoxy curing agent_3017c72b

Features Of LAN-XESS UX 550 Epoxy Curing Agent

  1. Fast-reacting aliphatic amine-based curing agent enabling rapid gelation and handling strength development at ambient temperatures.

  2. Low viscosity (< 500 mPa·s at 25 °C) ensures excellent mixability with standard epoxy resins and improved wetting of fillers and reinforcements.

  3. Low volatility and low odor profile support safer handling and improved workplace compliance versus traditional amine hardeners.

  4. Delivers high crosslink density, resulting in superior chemical resistance, thermal stability, and mechanical performance in cured systems.

  5. Compatible with common diglycidyl ether of bisphenol-A (DGEBA) and novolac epoxy resins without requiring solvent addition.

Typical Applications Of LAN-XESS UX 550 Epoxy Curing Agent

  1. High-performance structural adhesives for automotive and aerospace assembly.

  2. Electrical encapsulants and potting compounds requiring fast turnaround and low exotherm.

  3. Industrial flooring and heavy-duty protective coatings for chemical plants and warehouses.

  4. Composite matrix resins for pultrusion and filament winding of FRP profiles and rods.

  5. Repair mortars and grouts where rapid return-to-service is critical.

Specifications Of LAN-XESS UX 550 Epoxy Curing Agent

Chemical TypeAliphatic polyamine adduct
Product FormLiquid
AppearancePale yellow to amber clear liquid
Viscosity (25 °C)350–450 mPa·s
Density (20 °C)0.92–0.95 g/cm³
Amine Value380–420 mg KOH/g
Primary ApplicationsStructural adhesives, coatings, composites, electrical encapsulation
Key FeaturesFast cure, low viscosity, low odor, ambient-cure capability


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