High-performance bisphenol-F type epoxy resin offering superior chemical resistance and thermal stability.
Low viscosity formulation enables excellent processability for impregnation, casting, and coating applications.
Excellent adhesion to diverse substrates including metals, composites, and cured thermosets.
Consistent reactivity profile ensures reliable curing behavior with standard amine and anhydride hardeners.
Low volatile organic compound (VOC) content, supporting environmentally responsible manufacturing practices.
Electrical insulation systems for medium- and high-voltage transformers and reactors.
Encapsulation and potting of power electronics, including IGBT modules and EV inverter components.
Structural adhesive formulations for aerospace composite bonding and repair.
High-durability protective coatings for offshore and industrial steel infrastructure.
Matrix resin in filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
| Chemical Type | Bisphenol-F based epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, encapsulation, structural composites, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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