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High thermal stability suitable for processing temperatures up to 300 °C.
Low volatility and minimal migration in polymer matrices during long-term service life.
Excellent compatibility with polycarbonate (PC), PC/ABS blends, and polyesters.
Halogen-free formulation meeting stringent environmental and regulatory requirements (e.g., RoHS, REACH).
Efficient gas-phase flame inhibition mechanism with low loading levels (typically 8–12 wt%).
Flame-retarded polycarbonate for electronic enclosures and housing components.
PC/ABS blends used in automotive interior parts requiring UL94 V-0 rating.
Engineering thermoplastics for IT and telecommunications equipment housings.
LED lighting fixtures and optical components demanding clarity and fire safety.
Consumer electronics casings where low smoke density and non-corrosive decomposition are critical.
| Chemical Type | Organophosphorus compound (Bisphenol A bis(diphenyl phosphate)) |
| Product Form | White to off-white granular solid |
| Appearance | Free-flowing granules, no visible impurities |
| Molecular Weight (approx.) | 990 g/mol |
| Phosphorus Content | 5.6–5.9 wt% |
| Decomposition Onset Temperature | ≥290 °C (by TGA, 10 °C/min, N₂) |
| Moisture Content | ≤0.1 wt% |
| Density | 1.28–1.32 g/cm³ |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
