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High epoxy equivalent weight (EEW) of 480–520 g/eq, ensuring excellent reactivity control and balanced crosslink density.
Low viscosity at 25°C (12,000–15,000 cP), enabling easy handling, mixing, and processing in solvent-free or low-solvent systems.
Superior thermal stability with glass transition temperature (Tg) of cured resin exceeding 125°C after post-cure.
Consistent batch-to-batch reproducibility, meeting ISO 9001-certified manufacturing standards.
Low chloride content (< 750 ppm), minimizing corrosion risk in metal-coating and electronic encapsulation applications.
Electrical insulation coatings for transformers, reactors, and busbars.
Structural adhesives in aerospace and automotive composite bonding.
Prepreg matrices for high-performance carbon fiber laminates.
Encapsulation resins for power electronics and LED modules.
High-durability flooring and protective linings for chemical storage tanks.
| Chemical Type | Bisphenol A-based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 480–520 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 750 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Softening Point | 12–16°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
