High-purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Low volatile organic compound (VOC) content, supporting compliance with stringent environmental and workplace safety standards.
Excellent compatibility with common amine and anhydride curing agents, enabling flexible formulation design.
Superior adhesion to metals, composites, and cured polymer substrates under ambient and elevated temperature conditions.
Good thermal stability and hydrolytic resistance, contributing to long-term performance in demanding service environments.
Structural adhesives for automotive assembly and aerospace bonding applications.
Matrix resin in fiber-reinforced composites for wind turbine blades and industrial laminates.
Electrical encapsulation and potting compounds for power electronics and LED modules.
High-performance coatings for corrosion protection of steel infrastructure and marine equipment.
Tooling resins used in mold-making for composite part replication and rapid prototyping.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Volatiles (Loss on Drying at 150°C) | ≤ 0.3 wt% |
| Primary Applications | Adhesives, composites, encapsulants, coatings |
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E-mail: wangxingqiang@ericwchem.com
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