High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Excellent thermal stability and low volatility, supporting high-temperature processing and long pot life.
Superior adhesion to metals, composites, and cured thermosets—ideal for structural bonding applications.
Low ionic chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and metal-coating systems.
Optimized viscosity (12,000–16,000 cP at 25°C) for efficient mixing, degassing, and flow-assisted molding processes.
Electrical insulation and potting compounds for transformers, reactors, and high-voltage switchgear.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
High-performance protective coatings for offshore platforms, chemical storage tanks, and industrial flooring.
Prepreg matrix resin for carbon fiber reinforced polymer (CFRP) laminates in wind turbine blades and sporting goods.
Encapsulants for power electronics, LED modules, and sensor housings requiring thermal cycling resistance.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid without sediment or haze |
| Epoxide Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content (as Cl⁻) | ≤ 500 ppm |
| Softening Point | 12–15°C |
| Primary Applications | Structural adhesives, electrical encapsulation, high-performance coatings, prepregs |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China