Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Sanmu SM639 Bisphenol A Epoxy Resin

Sanmu SM639 is a high-purity Bisphenol A epoxy resin from the Sanmu SM series, offering excellent adhesion, chemical resistance and thermal stability. Widely used in composites, coatings and electronic encapsulation, it features low viscosity, superior mechanical strength and consistent reactivity for reliable processing and performance.
  • sanmu sm639 bisphenol a epoxy resin_bfd034c1
  • sanmu sm639 bisphenol a epoxy resin_bfd034c1

Features Of Sanmu SM639 Bisphenol A Epoxy Resin

  1. High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.

  2. Excellent thermal stability and low volatility, supporting high-temperature processing and long pot life.

  3. Superior adhesion to metals, composites, and cured thermosets—ideal for structural bonding applications.

  4. Low ionic chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and metal-coating systems.

  5. Optimized viscosity (12,000–16,000 cP at 25°C) for efficient mixing, degassing, and flow-assisted molding processes.

Typical Applications Of Sanmu SM639 Bisphenol A Epoxy Resin

  1. Electrical insulation and potting compounds for transformers, reactors, and high-voltage switchgear.

  2. Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.

  3. High-performance protective coatings for offshore platforms, chemical storage tanks, and industrial flooring.

  4. Prepreg matrix resin for carbon fiber reinforced polymer (CFRP) laminates in wind turbine blades and sporting goods.

  5. Encapsulants for power electronics, LED modules, and sensor housings requiring thermal cycling resistance.

Specifications Of Sanmu SM639 Bisphenol A Epoxy Resin

Chemical TypeBisphenol A diglycidyl ether (DGEBA) epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceTransparent, slightly yellow, homogeneous liquid without sediment or haze
Epoxide Equivalent Weight (EEW)187–193 g/eq
Viscosity (25°C)12,000–16,000 cP
Chloride Content (as Cl⁻)≤ 500 ppm
Softening Point12–15°C
Primary ApplicationsStructural adhesives, electrical encapsulation, high-performance coatings, prepregs


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