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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins at ambient and elevated temperatures.
Excellent chemical resistance in cured systems, particularly against alkalis and solvents.
Low viscosity enables easy handling, precise metering, and uniform dispersion in formulated systems.
Provides superior mechanical strength and thermal stability in final cured composites.
Compatible with common accelerators and modifiers for tailored cure profiles and processing windows.
Electrical insulation encapsulants for power electronics and transformers.
Structural adhesives in automotive and aerospace composite bonding.
Protective coatings for industrial flooring and corrosion-resistant linings.
High-performance potting compounds for LED modules and sensor housings.
Wind turbine blade matrix resins requiring extended pot life and rapid post-cure development.
| Chemical Type | Aromatic amine-based curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Primary Applications | Epoxy resin curing for high-performance composites and encapsulants |
| Key Features | Reactive amine functionality, low volatility, non-crystallizing |
| Benefits | Improved interlaminar shear strength, reduced exotherm, enhanced Tg retention |
| Storage Stability | Stable under nitrogen atmosphere at 5–25°C for ≥12 months |
| Handling Precautions | Use in well-ventilated areas; skin/eye protection recommended per SDS |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
