Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Shin-Etsu CHN-6600-U Silicone Rubber

Shin-Etsu CHN-6600-U is a high-transparency, platinum-cured liquid silicone rubber (LSR) offering excellent thermal stability, low compression set, and superior flow for precision molding. Ideal for medical devices, baby products, and automotive seals, it complies with ISO 10993 and USP Class VI standards. Fast cure, low volatility, and consistent rheology ensure reliable high-volume production.
  • shin etsu chn 6600 u silicone rubber_5a794c72
  • shin etsu chn 6600 u silicone rubber_5a794c72

Features Of Shin-Etsu CHN-6600-U Silicone Rubber

  1. High tear strength and excellent elongation for demanding dynamic sealing applications.

  2. Outstanding resistance to compression set, ensuring long-term sealing performance under continuous stress.

  3. Good processability with low viscosity before curing, enabling efficient injection molding and extrusion.

  4. Meets UL 94 V-0 flammability rating for enhanced safety in electrical and electronic assemblies.

  5. Stable physical properties across a wide temperature range (–60 °C to +200 °C).

Typical Applications Of Shin-Etsu CHN-6600-U Silicone Rubber

  1. Automotive under-hood gaskets and vibration-damping mounts.

  2. Sealing components for industrial sensors and control units.

  3. Insulating housings and protective boots for power electronics modules.

  4. Medical device enclosures requiring biocompatibility-compliant silicone (ISO 10993 tested).

  5. Consumer electronics waterproofing seals for wearables and portable devices.

Specifications Of Shin-Etsu CHN-6600-U Silicone Rubber

Chemical TypePlatinum-cured high-consistency silicone rubber (HCR)
Product FormTwo-part compound (Part A: base; Part B: platinum catalyst)
AppearanceOpaque, off-white to light gray dough-like mass
Shore A Hardness (ASTM D2240)60 ± 3
Tensile Strength (ASTM D412)≥ 8.0 MPa
Elongation at Break (ASTM D412)≥ 350 %
Compression Set (22 hrs @ 175 °C, ASTM D395 Method B)≤ 25 %
Curing SystemPt-catalyzed addition cure (no by-products)


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