Two-part, addition-cure liquid silicone rubber system offering excellent flowability and low viscosity for precision molding.
High thermal stability with continuous service temperature up to 200 °C and short-term resistance to 250 °C.
Outstanding electrical insulation properties and low dielectric loss across wide frequency and temperature ranges.
Excellent adhesion to various substrates including metals, plastics, and glass without primer under optimized conditions.
UL 94 V-0 rated flame retardancy when cured, meeting stringent safety requirements for electronic encapsulation.
Encapsulation and potting of high-voltage power electronics and IGBT modules.
Sealing and insulating components in automotive EV battery management systems (BMS).
Thermal interface material (TIM) bonding layers for LED lighting housings and heat sinks.
Protective coatings for aerospace-grade sensors and avionics connectors.
Dielectric gasketing in renewable energy inverters and solar microconverters.
| Chemical Type | Platinum-catalyzed addition-cure silicone rubber |
| Product Form | Two-component liquid (Part A: base; Part B: catalyst) |
| Appearance | Part A: translucent colorless liquid; Part B: translucent pale yellow liquid |
| Mix Ratio (A:B) by Weight | 10:1 |
| Shore A Hardness (Cured, 7 days @ 25 °C + post-cure) | 45 ± 3 |
| Tensile Strength (ASTM D412) | 8.5 MPa min |
| Elongation at Break (ASTM D412) | 280% min |
| Volume Resistivity (ASTM D257) | 1.0 × 10¹⁵ Ω·cm min |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China