Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Shin-Etsu KE-552B-U Silicone Rubber

Shin-Etsu KE-552B-U is a high-performance addition-cure liquid silicone rubber offering excellent flowability, low viscosity, and superior thermal stability. Ideal for precision molding of medical devices and electronics encapsulation, it delivers outstanding biocompatibility, low shrinkage, and consistent cure at room or elevated temperatures. Part of Shin-Etsu’s KE-550 series, this platinum-catalyzed elastomer ensures reliable reproducibility and minimal byproduct formation.
  • shin etsu ke 552b u silicone rubber_81348e32
  • shin etsu ke 552b u silicone rubber_81348e32

Features Of Shin-Etsu KE-552B-U Silicone Rubber

  1. Two-part, addition-cure liquid silicone rubber with excellent flowability and low viscosity for precise mold filling.

  2. High thermal stability and long-term reliability over a wide operating temperature range (–60 °C to +200 °C).

  3. Low compression set and outstanding elasticity retention after prolonged heat exposure.

  4. Excellent electrical insulation properties with high dielectric strength and volume resistivity.

  5. Biocompatibility compliant with ISO 10993-5 and USP Class VI for medical-grade applications.

Typical Applications Of Shin-Etsu KE-552B-U Silicone Rubber

  1. Medical device components including seals, gaskets, and implantable sensor encapsulants.

  2. Automotive under-hood parts requiring resistance to engine oil, coolant, and thermal cycling.

  3. Electrical insulation for high-voltage connectors, potting compounds, and LED module encapsulation.

  4. Consumer electronics housings and soft-touch overmolding on rigid substrates.

  5. Industrial sealing solutions for food processing equipment meeting FDA CFR Title 21 compliance.

Specifications Of Shin-Etsu KE-552B-U Silicone Rubber

Chemical TypePlatinum-catalyzed addition-cure liquid silicone rubber
Product FormTwo-component (Part A: base polymer; Part B: curing agent)
AppearanceTranslucent, low-viscosity liquid (Part A); colorless to pale yellow liquid (Part B)
Primary ApplicationsMedical, automotive, electronics, industrial sealing
Key FeaturesLow shrinkage, excellent adhesion to substrates, no by-products during cure
BenefitsShort cycle times, reproducible precision molding, minimal post-cure requirements
Cure SystemHeat-cured (e.g., 150 °C for 5 minutes)
Storage Stability12 months at ≤25 °C in unopened original packaging


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