Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay HTM 556 Adhesive

Solvay HTM 556 Adhesive is a high-temperature, thermosetting polyimide film adhesive from Solvay’s HTM series. Designed for aerospace and electronics bonding, it delivers exceptional thermal stability up to 288°C, low outgassing, and strong adhesion to composites and metals. Its solvent-free, easy-to-handle film format ensures precise application and reliable performance in demanding environments.
  • solvay htm 556 adhesive_a80ba4b9
  • solvay htm 556 adhesive_a80ba4b9

Features Of Solvay HTM 556 Adhesive

  1. High-temperature resistance up to 250 °C continuous service

  2. Excellent chemical resistance to aviation fuels, hydraulic fluids, and de-icing agents

  3. Low outgassing performance compliant with ASTM E595 for space applications

  4. Single-component formulation with extended room-temperature shelf life

  5. Good adhesion to aluminum, titanium, stainless steel, and composite substrates

Typical Applications Of Solvay HTM 556 Adhesive

  1. Aerospace structural bonding of engine nacelles and airframe components

  2. Defense electronics encapsulation and thermal interface bonding

  3. Satellite subsystem assembly requiring vacuum-stable materials

  4. High-reliability bonding in turbine and auxiliary power unit (APU) assemblies

  5. Repair and rework of heat-exposed avionics housings

Specifications Of Solvay HTM 556 Adhesive

Chemical TypeHigh-performance polyimide-based adhesive
Product FormPaste, supplied in sealed aluminum foil laminate pouches
AppearanceUniform brown viscous paste
Primary ApplicationsStructural bonding, potting, and sealing in extreme thermal environments
Key FeaturesHigh Tg (>300 °C), low volatile content, NASA/ESA space-qualified
BenefitsReduces need for mechanical fasteners; enables lightweight, thermally stable assemblies
Curing Schedule120 °C/2 h + 250 °C/2 h (ramp rate: 2 °C/min)
Storage Condition-20 °C in original unopened packaging; stable for 12 months


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