Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

SSP SSPCH Vinyl Chloride Copolymer Resin

SSP SSPCH Vinyl Chloride Copolymer Resin is a high-performance specialty polymer from SSP’s SSPCH series, engineered for superior chemical resistance, thermal stability and adhesion in coatings, inks and adhesives. It offers excellent film-forming ability, low viscosity, and compatibility with plasticizers and other resins—ideal for demanding industrial applications requiring durability and consistency.
  • ssp sspch vinyl chloride copolymer resin_c3afc4d1
  • ssp sspch vinyl chloride copolymer resin_c3afc4d1

Features Of SSP SSPCH Vinyl Chloride Copolymer Resin

  1. Excellent chemical resistance to acids, alkalis, and aliphatic hydrocarbons.

  2. Superior thermal stability for processing at elevated extrusion and calendering temperatures.

  3. High molecular weight consistency ensuring uniform melt flow and mechanical performance.

  4. Low residual vinyl chloride monomer (VCM) content, compliant with global food-contact and safety standards.

  5. Enhanced compatibility with plasticizers, stabilizers, and fillers for versatile formulation flexibility.

Typical Applications Of SSP SSPCH Vinyl Chloride Copolymer Resin

  1. Rigid and semi-rigid PVC profiles for window frames and door systems.

  2. High-performance flooring compounds including luxury vinyl tile (LVT) and sheet vinyl.

  3. Industrial linings and tank coatings requiring corrosion resistance.

  4. Medical tubing and pharmaceutical packaging components meeting ISO 10993 requirements.

  5. Automotive interior trim and under-hood components demanding dimensional stability.

Specifications Of SSP SSPCH Vinyl Chloride Copolymer Resin

Chemical TypeVinyl chloride–vinyl acetate copolymer
Product FormFree-flowing white powder
AppearanceWhite to off-white granular or fine powder
K-Value (ASTM D1243)65–72
Residual VCM Content (ppm)< 5 ppm
Bulk Density (g/cm³)0.45–0.55
Particle Size Distribution (D50, μm)80–120
Thermal Decomposition Onset (°C, TGA)> 190


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