English
Español
tiếng việt
русский
High reactivity with polyols, enabling rapid gelation and reduced cycle times in thermoset processing.
Excellent compatibility with aromatic and aliphatic isocyanates in non-polyurethane (NPU) systems.
Low volatility and minimal odor, supporting safer handling and improved workplace air quality.
Thermal stability up to 180 °C, maintaining structural integrity during high-temperature curing stages.
Consistent batch-to-batch performance, certified under ISO 9001-compliant manufacturing controls.
Electronics encapsulation resins requiring low-ionic impurity and high dielectric strength.
High-performance composites for aerospace tooling and mold-making matrices.
Advanced potting compounds used in automotive power electronics and EV battery modules.
Structural adhesives for metal-to-composite bonding in industrial assembly.
| Chemical Type | Amine-based latent curing agent |
| Product Form | Powder |
| Appearance | Off-white to light beige free-flowing powder |
| Primary Applications | Epoxy and phenolic resin systems (non-polyurethane) |
| Key Features | Latent reactivity, low moisture sensitivity, high thermal latency |
| Benefits | Extended pot life at ambient temperature; sharp cure onset above 130 °C |
| Storage Conditions | Store sealed under dry nitrogen at 5–25 °C; protect from humidity |
| Shelf Life | 12 months from date of manufacture under recommended conditions |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
