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High thermal conductivity for efficient heat dissipation in electronic components.
Excellent electrical insulation properties combined with thermal management capability.
Low modulus and high elasticity ensure stress relief and long-term reliability under thermal cycling.
Platinum-catalyzed addition-cure system enables precise, reproducible processing without by-products.
Good adhesion to common substrates including metals, ceramics, and plastics without primers.
Thermal interface material (TIM) for power electronics and LED modules.
Encapsulation and potting of IGBTs, MOSFETs, and other high-power semiconductor devices.
Gap-filling material between heat sinks and electronic components in automotive ECUs.
Dielectric thermal padding in renewable energy inverters and battery management systems.
Underfill and conformal coating for thermally sensitive sensors and control units.
| Chemical Type | Platinum-catalyzed addition-curing silicone rubber |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance | Opaque, off-white to light gray paste |
| Primary Applications | Thermal interface materials, encapsulation, and gap filling |
| Key Features | High thermal conductivity, electrically insulating, low compression set |
| Benefits | Improved device lifetime, reduced thermal resistance, process stability |
| Curing Mechanism | Addition reaction (no volatile by-products) |
| Storage Conditions | Store at 5–25 °C; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
