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High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in power electronics.
Excellent electrical insulation properties with volume resistivity >1×10¹⁴ Ω·cm.
Low modulus and high flexibility enabling stress relief in bonded assemblies under thermal cycling.
Platinum-catalyzed addition cure system ensuring low shrinkage, no by-products, and precise dimensional stability.
Good adhesion to common substrates including aluminum, copper, ceramics, and epoxy PCBs without primers.
Thermal interface material (TIM) between IGBT modules and heat sinks in electric vehicle inverters.
Encapsulation and potting of high-power LED drivers and AC/DC converters.
Die-attach and underfill for power semiconductor packages requiring long-term thermal reliability.
Gap-filling thermal pads for battery management systems (BMS) and onboard chargers.
| Chemical Type | Platinum-catalyzed addition-cure silicone rubber |
| Product Form | Two-component paste (Part A: filler-rich base; Part B: catalyst) |
| Appearance | Off-white to light gray viscous paste (Part A); colorless to pale yellow paste (Part B) |
| Primary Applications | Thermal interface materials, potting, encapsulation, gap filling |
| Key Features | High thermal conductivity, electrical insulation, low modulus, addition cure |
| Shore A Hardness (7 days @ 23°C) | 25–35 |
| Density (23°C) | Approx. 2.1 g/cm³ |
| Operating Temperature Range | −50°C to +200°C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
