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Ultra-low ionic impurity content meeting stringent electronic-grade purity requirements (Na⁺, K⁺, Ca²⁺, Mg²⁺ < 1 ppb each).
Highly uniform spherical bead morphology ensuring consistent polishing performance and minimal particle generation.
Optimized low-tortuosity macroporous structure for rapid ion exchange kinetics and reduced pressure drop in polishing columns.
Exceptional chemical stability in ultra-pure water and dilute acid/base environments typical of semiconductor ultrapure water (UPW) systems.
Pre-compacted and pre-rinsed to minimize initial rinse volume and accelerate system commissioning in critical UPW loops.
Final polishing stage in semiconductor-grade ultrapure water (UPW) production systems.
Polishing loop resin for 18.2 MΩ·cm resistivity water in advanced microelectronics fabrication facilities.
Trace metal removal in photovoltaic cell manufacturing process water circuits.
Ultrapure rinse water polishing for EUV lithography tool support systems.
| Chemical Type | Strong Acid Cation (SAC) / Strong Base Anion (SBA) Mixed Bed Resin |
| Product Form | Pre-mixed, pre-compacted, ready-to-use mixed bed resin |
| Appearance | Uniform spherical beads, dark brown (cation) and off-white (anion) — visually distinguishable in mixture |
| Functional Groups | Cation: Sulfonic acid (–SO₃H); Anion: Quaternary ammonium (–N⁺(CH₃)₃) |
| Moisture Content | 45–50% (as shipped) |
| Particle Size Range | 300–1200 μm (95% retained) |
| Temperature Limit | ≤ 50 °C continuous operation |
| Storage Conditions | 5–35 °C, sealed original packaging, avoid freezing and direct sunlight |
Q1: What distinguishes ZGER 8415 LT from standard polishing resins?
A: ZGER 8415 LT is specifically engineered for electronic-grade applications, featuring ultra-low ionic impurity content, tightly controlled particle size distribution, and enhanced thermal stability to minimize residue and micro-scratching during precision polishing of sensitive semiconductor and display substrates.
Q2: Is ZGER 8415 LT compatible with aqueous-based CMP slurries?
A: Yes — it is formulated for stable dispersion in neutral to mildly alkaline aqueous systems and demonstrates excellent compatibility with common oxidizers, surfactants, and rheology modifiers used in electronic-grade chemical mechanical planarization (CMP) formulations.
Q3: How should ZGER 8415 LT be stored to maintain performance integrity?
A: Store in original sealed containers under cool, dry conditions away from direct sunlight and strong oxidizing agents. Prolonged exposure to high humidity or elevated temperatures may affect flowability and dispersion consistency.
Q4: Can ZGER 8415 LT be used in slurry formulations for copper or low-k dielectric polishing?
A: Yes — its tailored surface chemistry and mechanical properties support effective material removal and surface finish control on both copper interconnects and porous low-k dielectrics, especially where minimal defect generation and post-polish cleaning efficiency are critical.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
