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Ultra-low ionic impurity content, meeting stringent SEMI F55 and ASTM D1193 Type E1 water purity requirements for semiconductor manufacturing.
Highly uniform spherical bead morphology ensures consistent polishing performance and minimal surface scratching on wafers.
Optimized cation/anion exchange capacity balance for precise pH and conductivity control in ultrapure water (UPW) final polishing loops.
Exceptional chemical stability in high-purity deionized water systems, resistant to oxidative degradation under continuous operation.
Low extractables profile—validated via TOC and silica leaching tests—to prevent contamination of sensitive photolithography and etch processes.
Final polishing stage in ultrapure water (UPW) generation systems for semiconductor fabrication facilities (fabs).
Polishing resin in mixed-bed ion exchange units for critical rinse water in 300mm wafer cleaning lines.
Ultra-low conductivity polishing media for CMP (Chemical Mechanical Planarization) slurry make-up water systems.
High-purity water polishing in advanced packaging and MEMS manufacturing cleanroom water loops.
Final-stage deionization in analytical laboratory UPW systems requiring sub-ppb metal ion removal.
| Chemical Type | Strong acid cation / strong base anion mixed-bed resin |
| Product Form | Uniform spherical beads, pre-mixed 1:1 cation:anion ratio |
| Appearance | Transparent amber (cation) and white (anion) beads, no fines or dust |
| Particle Size Range | 0.45–0.75 mm (D₁₀ ≥ 0.40 mm, D₉₀ ≤ 0.80 mm) |
| Moisture Content | 48–52% (as shipped, hydrated form) |
| Exchange Capacity (Total) | ≥ 1.6 eq/L (wet volume, both resins combined) |
| Maximum Operating Temperature | 50 °C (continuous), 60 °C (intermittent) |
| Storage Stability | 24 months unopened at 5–35 °C; avoid freezing and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
