English
Español
tiếng việt
русский
High reactivity with epoxy resins at moderate cure temperatures (100–140 °C), enabling efficient processing and reduced cycle times.
Excellent electrical insulation properties, including low dielectric loss and high volume resistivity, ideal for high-reliability electronic encapsulation.
Superior thermal stability and glass transition temperature (Tg) retention in cured epoxy systems, supporting long-term performance above 150 °C.
Low volatility and minimal exotherm during curing, enhancing safety and reducing internal stress in thick-section castings.
Good compatibility with standard bisphenol-A and novolac epoxy resins, facilitating formulation flexibility without phase separation.
Electrical insulation of high-voltage dry-type transformers and reactors.
Encapsulation and potting of power electronics, including IGBT modules and EV battery management systems.
Casting of high-performance busbars, insulators, and switchgear components for energy infrastructure.
Structural adhesives requiring elevated thermal and dielectric performance in aerospace and rail applications.
Laminating resin for high-Tg prepregs used in printed circuit board (PCB) substrates and advanced composites.
| Chemical Type | Methylhexahydrophthalic anhydride (MHHPA), alicyclic acid anhydride |
| Product Form | Pale yellow to light amber liquid |
| Appearance | Clear, transparent, free from visible particulates or haze |
| Acid Value (mg KOH/g) | 670–690 |
| Refractive Index (n20D) | 1.485–1.492 |
| Viscosity (mPa·s at 25 °C) | 35–55 |
| Flash Point (°C, closed cup) | ≥155 |
| Primary Applications | Epoxy resin curing for electrical insulation, encapsulation, and structural composites |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
