High epoxy equivalent weight (EEW) for controlled crosslink density and reduced exotherm in thick-section casting.
Excellent hydrolytic stability, enhancing long-term performance in humid or outdoor environments.
Low ionic chloride content (< 500 ppm), minimizing corrosion risk in metal-reinforced composites and electronic encapsulants.
Optimized viscosity (12,000–16,000 mPa·s at 25°C) for improved filler loading and processability in high-solids formulations.
Consistent batch-to-batch reproducibility, meeting stringent quality requirements for aerospace and industrial coatings.
High-performance electrical potting and encapsulation compounds for power electronics and EV components.
Structural adhesives requiring thermal stability and low shrinkage during cure.
Heavy-duty protective coatings for offshore platforms and chemical processing equipment.
Reinforced polymer composites in wind turbine blade root joints and mining equipment parts.
High-gloss, UV-resistant industrial floor coatings with enhanced abrasion resistance.
| Chemical Type | Bisphenol A-based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels and suspended matter |
| Epoxy Equivalent Weight (EEW) | 4,700–4,900 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content (as Cl⁻) | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Potting, encapsulation, structural adhesives, protective coatings, composite matrices |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China