Highly reactive liquid bisphenol-A based epoxy resin with low viscosity for excellent processability.
Optimized molecular weight distribution ensuring consistent reactivity and predictable cure kinetics.
Low chlorine content supporting compliance with stringent regulatory requirements for coatings and adhesives.
Excellent compatibility with common amine, anhydride, and phenolic curing agents.
Superior adhesion to metals, composites, and concrete substrates in demanding industrial environments.
High-performance protective coatings for offshore and marine infrastructure.
Electrical encapsulation and potting compounds for power electronics and transformers.
Structural adhesives in aerospace and automotive composite bonding.
Wind turbine blade matrix resins and repair systems.
Industrial flooring systems requiring chemical resistance and mechanical durability.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 183–190 g/eq |
| Viscosity at 25°C | 11,000–14,000 mPa·s |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Coatings, adhesives, composites, electrical encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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