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Highly latent at room temperature—enables extended pot life and ambient storage stability.
Activates rapidly upon heating (typically >100°C), delivering efficient epoxy resin curing without external catalysts.
Halogen-free formulation, supporting environmentally responsible manufacturing and regulatory compliance (e.g., RoHS, REACH).
Excellent compatibility with standard bisphenol-A and novolac epoxy resins.
Yields cured networks with high glass transition temperature (Tg) and superior mechanical strength.
Prepreg systems for aerospace and high-performance composites.
Electrically insulating encapsulants and potting compounds in power electronics.
Thermosetting adhesives for automotive structural bonding.
UV/heat dual-cure coatings requiring delayed thermal activation.
Printed circuit board (PCB) laminates and dielectric films.
| Chemical Type | Latent imidazole derivative |
| Product Form | Powder |
| Appearance | White to off-white free-flowing powder |
| Primary Applications | Epoxy resin curing agent for high-reliability thermosets |
| Key Features | Room-temperature stability, heat-activated latency, halogen-free |
| Recommended Cure Schedule | 150°C for 60 minutes (typical) |
| Storage Conditions | Store sealed under dry conditions at 5–30°C |
| Shelf Life | 12 months from date of manufacture when stored properly |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
