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Highly latent at ambient temperature, enabling extended pot life and improved processing flexibility.
Activates rapidly upon thermal trigger (typically >100 °C), delivering efficient epoxy crosslinking.
Halogen-free formulation supporting environmental compliance and low halogen content requirements.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Low volatility and minimal odor, enhancing workplace safety and handling convenience.
Electronics encapsulation and underfill materials requiring precise thermal activation.
Prepregs and composite laminates for aerospace and wind energy structures.
Structural adhesives used in automotive bonding and lightweight assembly.
Coating systems for metal substrates demanding high-throughput oven curing.
3D printing resin formulations where shelf stability and controlled reactivity are critical.
| Chemical Type | Latent amine-based epoxy curing agent |
| Product Form | Free-flowing off-white to light tan powder |
| Appearance | Crystalline granular solid |
| Primary Applications | Epoxy resin systems requiring thermal latency and rapid cure |
| Key Features | Halogen-free, low dust generation, excellent storage stability |
| Recommended Storage | Sealed container at 5–25 °C; protect from moisture |
| Onset of Reactivity | ~105 °C (by DSC, heating rate 10 °C/min) |
| Shelf Life | ≥12 months under recommended storage conditions |
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