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Low-viscosity, solvent-free amine adduct formulation enabling excellent flow and wetting on diverse substrates.
Extended pot life at ambient temperature with rapid cure development upon mild thermal activation (60–80°C).
Exceptional chemical resistance to hydrocarbons, solvents, and alkaline environments in cured epoxy systems.
Low exotherm profile suitable for thick-section casting and large-area coating applications without cracking or blistering.
Meets stringent VOC regulations and contains no intentionally added heavy metals or restricted phthalates.
High-performance industrial flooring and concrete protection systems.
Structural adhesive formulations for aerospace and automotive composites bonding.
Electrical encapsulation and potting compounds requiring thermal stability and dielectric integrity.
Marine and offshore protective coatings exposed to saltwater immersion and UV weathering.
Wind turbine blade bonding and repair matrices demanding fatigue resistance and low moisture uptake.
| Chemical Type | Amine adduct (polyoxyalkylene-modified aliphatic amine) |
| Product Form | Liquid |
| Appearance | Clear, pale yellow to amber viscous liquid |
| Primary Applications | Epoxy resin curing for coatings, adhesives, and composites |
| Key Features | Low viscosity, extended working time, thermal latency, low odor |
| Benefits | Improved processability, reduced internal stress, enhanced interfacial adhesion |
| Storage Stability | 12 months minimum at 25°C in sealed original container |
| Handling Precautions | Use in well-ventilated areas; wear nitrile gloves and safety goggles |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
