High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with amine and anhydride curing agents for broad formulation flexibility.
Consistent reactivity and low viscosity enabling easy processing and improved wetting of substrates.
Superior electrical insulation properties suitable for demanding electronic encapsulation applications.
Good thermal stability and mechanical strength retention after full cure.
Electrical and electronic encapsulants and potting compounds.
High-voltage insulating varnishes and impregnating resins.
Structural adhesives requiring high bond strength and chemical resistance.
Composite matrix resins for aerospace and industrial laminates.
Coatings for metal substrates in corrosion-resistant industrial systems.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 1,000 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Encapsulation, electrical insulation, structural adhesives |
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E-mail: wangxingqiang@ericwchem.com
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