High-performance solid epoxy resin offering excellent thermal stability and chemical resistance.
Low volatile organic compound (VOC) content, supporting sustainable manufacturing processes.
Superior mechanical strength and dimensional stability after curing.
Excellent adhesion to metals, composites, and engineered plastics.
Designed for precise stoichiometric blending with standard amine or anhydride hardeners.
Aerospace composite matrix resins for structural laminates and prepregs.
High-reliability electrical encapsulation and potting in power electronics.
Advanced wind turbine blade bonding and structural adhesives.
Industrial tooling and mold-making where thermal and moisture resistance are critical.
Automotive under-hood components requiring long-term performance at elevated temperatures.
| Chemical Type | Bisphenol-F based solid epoxy resin |
| Product Form | Pale yellow to light amber solid flakes |
| Appearance | Free-flowing crystalline solid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Melting Range | 65–75 °C |
| Softening Point (Ring & Ball) | 68–72 °C |
| Volatiles Content (105 °C, 2 h) | < 0.3 wt% |
| Key Features | High reactivity, low melt viscosity, excellent storage stability |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China