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High-purity sebacic acid-based curing agent for enhanced epoxy network stability.
Enables flexible, impact-resistant cured films with excellent low-temperature performance.
Low volatility and low odor profile—ideal for indoor and sensitive application environments.
Improved hydrolytic stability compared to conventional aliphatic diacid curing agents.
Compatible with standard epoxy resins (e.g., DGEBA) without requiring catalysts or accelerators.
Flexible epoxy coatings for concrete flooring and industrial maintenance.
Electrical encapsulation compounds requiring thermal cycling resistance.
Adhesives for composites in automotive interior and lightweight structural bonding.
UV-curable hybrid epoxy systems where post-cure flexibility is critical.
Marine-grade protective coatings exposed to humidity and salt environments.
| Chemical Type | Aliphatic dicarboxylic acid derivative |
| Product Form | White crystalline solid |
| Appearance | Free-flowing granular powder |
| Molecular Weight (approx.) | 202 g/mol |
| Melting Range | 130–134 °C |
| Acid Value | 550–565 mg KOH/g |
| Moisture Content (max) | 0.2 wt% |
| Primary Applications | Epoxy resin curing for flexible coatings, adhesives, and encapsulants |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
