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High reactivity with epoxy resins, enabling rapid cure at ambient or slightly elevated temperatures.
Excellent chemical resistance post-cure, particularly against solvents, acids, and alkalis.
Low viscosity for easy handling and homogeneous mixing with standard epoxy systems.
Good thermal stability and glass transition temperature (Tg) development in cured networks.
Compatible with a broad range of bisphenol-A and bisphenol-F based epoxy resins.
Structural adhesives for automotive and aerospace bonding applications.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance coatings for industrial flooring and chemical containment linings.
Composite matrix resins for wind turbine blade manufacturing and pultrusion.
Repair mortars and grouts requiring fast turnaround and high mechanical strength.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing for adhesives, coatings, composites, and electrical encapsulation |
| Key Features | Fast ambient cure, low viscosity, high crosslink density |
| Benefits | Reduced processing time, excellent adhesion, superior chemical resistance |
| Storage Stability | At least 12 months at 20–25 °C in original sealed container |
| Compatibility | Standard DGEBA and DGEBF epoxy resins |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
