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High purity Bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic chloride content for enhanced electrical insulation performance.
Optimized viscosity for improved processability in casting, laminating, and impregnation applications.
Superior adhesion to metals, fiberglass, and carbon substrates without requiring surface priming.
Low volatile organic compound (VOC) emission, supporting environmentally compliant manufacturing processes.
Electrical insulation systems for medium- and high-voltage transformers and bushings.
Structural composites in wind turbine blade root joints and marine hull laminates.
High-performance printed circuit board (PCB) prepregs and copper-clad laminates.
Adhesives and sealants for aerospace interior components requiring flame, smoke, and toxicity (FST) compliance.
Casting resins for encapsulation of sensors, power electronics, and LED modules.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of visible gels or particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 10–14°C |
| Storage Stability | ≥ 12 months at 20–25°C in sealed original packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
