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Fast-reacting aliphatic amine-based curing agent for rapid epoxy system development.
Excellent compatibility with standard liquid and solid bisphenol-A epoxy resins.
Delivers high mechanical strength and good chemical resistance in cured networks.
Low viscosity enables easy metering, mixing, and processing at ambient temperatures.
Provides balanced pot life and cure speed suitable for industrial coating and adhesive applications.
Industrial protective coatings for metal substrates.
Structural adhesives for automotive and assembly bonding.
Epoxy flooring systems requiring quick turnaround and durability.
Electrical encapsulation and potting compounds.
Composite matrix resins for non-aerospace industrial laminates.
| Chemical Type | Aliphatic polyamine |
| Product Form | Liquid |
| Appearance | Clear to pale yellow transparent liquid |
| Specific Gravity (25°C) | 0.92–0.96 g/cm³ |
| Viscosity (25°C) | 80–120 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Room temperature curing with moderate pot life (≈30–60 min at 25°C) |
| Primary Applications | Coatings, adhesives, flooring, encapsulation |
Q1: What is the primary chemical class of BE115?
A: BE115 is a modified aliphatic amine-based epoxy curing agent, designed to offer balanced reactivity, low volatility, and improved compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Q2: Is BE115 suitable for ambient-cure applications?
A: Yes — BE115 is formulated to enable effective curing at room temperature, making it well-suited for coatings, adhesives, and composite laminates where thermal post-curing is not feasible or desired.
Q3: How does BE115 compare to conventional DETA in terms of handling safety?
A: BE115 exhibits significantly lower vapor pressure and reduced skin sensitization potential compared to unmodified diethylenetriamine (DETA), supporting safer handling and improved workplace exposure profiles without compromising crosslink density.
Q4: What is the typical dosage range for BE115 in standard epoxy formulations?
A: Dosage depends on formulation requirements and target performance, but BE115 is generally used at low concentrations — typically ranging from 0.1% to 2% by weight relative to the epoxy resin — and should be optimized through small-scale trials.
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