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Excellent balance of mechanical strength and impact resistance for structural composite parts.
Low viscosity (250–350 cP at 25°C) enabling superior fiber wet-out and high filler loading capacity.
Good heat resistance with HDT above 85°C after post-cure, suitable for medium-temperature service environments.
Consistent reactivity profile ensuring reliable gel time control under standard MEKP initiation (1.0–1.5 wt%).
Low styrene emission formulation supporting improved workplace safety and regulatory compliance (VOC-reduced).
Fiberglass-reinforced plastic (FRP) tanks and chemical storage vessels.
Pultruded profiles including gratings, ladders, and structural beams.
Centrifugally cast pipes for water and wastewater infrastructure.
Sheet molding compound (SMC) components for electrical enclosures and transit interiors.
Marine deck cores and non-structural hull reinforcements.
| Chemical Type | Orthophthalic unsaturated polyester resin |
| Product Form | Liquid, ready-to-use |
| Appearance | Clear to pale yellow, homogeneous liquid |
| Viscosity (25°C) | 250–350 cP |
| Acid Value | 16–20 mg KOH/g |
| Styrene Content | 38–42 wt% |
| Density (25°C) | 1.10–1.13 g/cm³ |
| Reactivity (Gel Time, 1.2% MEKP, 25°C) | 8–12 minutes |
Q1: What are the primary application areas for ETERSET 2340?
A: ETERSET 2340 is widely used in fiberglass-reinforced plastic (FRP) applications such as tanks, pipes, and structural profiles, as well as in sheet molding compound (SMC) and bulk molding compound (BMC) formulations where good mechanical strength, dimensional stability, and moderate chemical resistance are required.
Q2: How does ETERSET 2340 compare to general-purpose unsaturated polyester resins in terms of reactivity and gel time?
A: ETERSET 2340 exhibits a balanced reactivity profile—neither excessively fast nor overly sluggish—allowing for reliable processing across common FRP manufacturing methods. Its gel time is typically adjustable within a practical range using standard peroxide initiators, supporting consistent mold release and part quality under typical ambient and elevated temperature conditions.
Q3: Is ETERSET 2340 suitable for use with low-profile additives or surface-saturation systems?
A: Yes, ETERSET 2340 demonstrates good compatibility with common low-profile additives (e.g., thermoplastic polymers) and surface-saturation systems, enabling improved surface finish and reduced post-mold shrinkage in high-gloss or Class-A applications—subject to proper formulation optimization and compatibility testing.
Q4: What type of initiators are recommended for curing ETERSET 2340?
A: Standard methyl ethyl ketone peroxide (MEKP) formulations are commonly used for room-temperature and warm-cure applications. For elevated-temperature processes, benzoyl peroxide (BPO) or low-temperature peroxides may be selected depending on the specific process window and desired cure profile.
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