Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Clariant Duasyn Ink Blue SLK Waterborne Dye

Clariant Duasyn Ink Blue SLK is a high-performance waterborne dye designed for inkjet inks, offering excellent solubility, color strength, and lightfastness. Part of Clariant’s Duasyn Ink series, this SLK-grade dye ensures consistent jetting stability, low particle content, and compatibility with aqueous ink systems used in digital textile and packaging printing applications.
  • clariant duasyn ink blue slk waterborne dye_629e269f
  • clariant duasyn ink blue slk waterborne dye_629e269f

Features Of Clariant Duasyn Ink Blue SLK Waterborne Dye

  1. Highly soluble in water, enabling stable, low-viscosity ink formulations.

  2. Excellent lightfastness and washfastness for durable color performance.

  3. Low migration tendency, supporting compliance with stringent food-contact and packaging regulations.

  4. Compatible with common waterborne polymer systems including acrylics and polyurethanes.

  5. Optimized for high-speed digital inkjet printing with consistent jetting reliability.

Typical Applications Of Clariant Duasyn Ink Blue SLK Waterborne Dye

  1. Water-based inkjet inks for textile digital printing.

  2. Decorative ink systems for coated paper and board packaging.

  3. Functional inks for flexible packaging requiring FDA-compliant colorants.

  4. Industrial marking inks for non-porous substrates like films and foils.

  5. Screen-printing inks for sustainable apparel and home textiles.

Specifications Of Clariant Duasyn Ink Blue SLK Waterborne Dye

Chemical TypeReactive-type water-soluble dye (monoazo structure)
Product FormLiquid concentrate (aqueous solution)
AppearanceClear to slightly hazy blue liquid
pH (10% aqueous solution)5.5–6.5
SolubilityCompletely miscible with water; no precipitation on dilution
Primary ApplicationsDigital textile inks, packaging inks, industrial marking inks
Key FeaturesWaterborne, low-VOC, REACH compliant, non-ionic
BenefitsReduced drying energy, improved substrate adhesion, minimal nozzle clogging


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