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Halogen-free formulation compliant with IEC 61249-2-21 and RoHS 2.0 directives.
Excellent thermal stability for soldering processes up to 260 °C (peak).
Superior adhesion to FR-4, polyimide, and metal substrates without primer.
Low halogen content (<900 ppm Cl, <900 ppm Br) verified by IC testing.
Optimized rheology for high-resolution screen printing and inkjet deposition.
Printed circuit board (PCB) solder mask in consumer electronics.
Flame-retardant marking ink for automotive control modules.
Surface protection layer for high-density interconnect (HDI) boards.
UL-certified conformal coating base for medical device PCBs.
Lead-free assembly compatible ink for industrial automation controllers.
| Chemical Type | Phosphorus-based reactive flame retardant additive |
| Product Form | Ready-to-use liquid ink concentrate |
| Appearance | Transparent to light amber viscous liquid |
| Primary Applications | Solder mask, legend ink, and protective topcoat for rigid/flex PCBs |
| Key Features | Halogen-free, UL 94 V-0 rated (film thickness ≥50 µm), non-migrating |
| Benefits | Reduces corrosive gas emission during combustion; compatible with standard UV curing systems |
| Storage Condition | 15–25 °C, dry, dark environment; shelf life 12 months unopened |
| Compliance | REACH SVHC-free, halogen-free per JPCA-ES-01-2003, IPC-4101D compatible |
Q1: What makes Deflamer LF-8006 suitable for halogen-free PCB ink formulations?
A: Deflamer LF-8006 is a non-halogenated, phosphorus-based flame retardant specifically engineered to deliver effective fire resistance in printed circuit board inks without releasing corrosive or toxic halogenated gases during thermal decomposition or combustion. Its molecular design ensures good compatibility with common epoxy, acrylic, and polyurethane resin systems used in PCB marking and solder mask inks.
Q2: How does LF-8006 affect ink viscosity, curing behavior, and adhesion performance?
A: When properly dispersed, Deflamer LF-8006 typically has minimal impact on ink rheology and does not interfere with standard UV or thermal curing mechanisms. It maintains excellent substrate adhesion on FR-4, polyimide, and metalized surfaces, and does not promote delamination or blistering under typical reflow conditions encountered in PCB assembly.
Q3: Is LF-8006 compatible with pigment dispersions and other additives commonly used in PCB inks?
A: Yes — Deflamer LF-8006 demonstrates broad compatibility with organic and inorganic pigments, photoinitiators, adhesion promoters, and flow agents. It shows no adverse interaction with conventional dispersants and remains stable in both solvent-borne and low-solvent ink systems during storage and processing.
Q4: What is the recommended dosage range for achieving UL 94 V-0 rating in PCB ink applications?
A: The effective dosage depends on the base resin chemistry, film thickness, and overall formulation balance. Deflamer LF-8006 is typically used at low concentrations, generally ranging from 0.1% to 2% by weight of the total ink formulation, to support flame-retardant performance consistent with UL 94 V-0 requirements for thin-film coatings.
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E-mail: wangxingqiang@ericwchem.com
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