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Halogen-free formulation ensures compliance with RoHS, REACH, and UL 94 V-0 requirements for polyamide systems.
Excellent thermal stability up to 300°C enables seamless integration into high-temperature polyamide processing (e.g., PA6, PA66).
Low migration tendency preserves long-term flame-retardant performance and surface aesthetics in finished parts.
Good compatibility with polyamide resins minimizes impact on mechanical properties such as tensile strength and impact resistance.
Non-corrosive to processing equipment and molds, reducing maintenance downtime and extending tool life.
Electrical connectors and housings for automotive ECUs and charging systems.
Consumer electronics enclosures requiring UL 94 V-0 rating at 1.5 mm thickness.
Industrial automation components exposed to elevated ambient temperatures.
LED lighting reflectors and heat sinks where halogen-free compliance is mandated.
Railway interior trim parts meeting EN 45545-2 fire safety standards.
| Chemical Type | Phosphorus-nitrogen synergistic intumescent system |
| Product Form | Free-flowing white granules |
| Appearance | Off-white to light beige granules |
| Primary Applications | Polyamide 6 (PA6), Polyamide 66 (PA66) |
| Key Features | Halogen-free, low smoke, non-corrosive |
| Benefits | Enables UL 94 V-0 at 1.5 mm; no brominated or chlorinated compounds |
| Density (g/cm³) | 1.35–1.45 |
| Recommended Loading Range (wt%) | 12–18% in PA6/PA66 |
Q1: What polyamide grades is Deflamer LFR-8006 compatible with?
A: Deflamer LFR-8006 is specifically engineered for use in aliphatic polyamides, including PA6, PA66, and their copolymers. It demonstrates excellent dispersion and thermal stability during melt processing, with minimal impact on mechanical properties such as tensile strength and impact resistance.
Q2: How does LFR-8006 achieve flame retardancy without halogenated compounds?
A: LFR-8006 operates primarily through an intumescent mechanism—promoting the formation of a thermally stable, insulating char layer upon exposure to heat or flame. This char shields the underlying polymer from heat flux and limits fuel release, enabling compliance with UL94 V-0 and similar flammability classifications at appropriate loadings.
Q3: Does LFR-8006 affect the processing behavior of polyamide melts?
A: LFR-8006 exhibits good thermal stability up to typical polyamide processing temperatures (e.g., 260–280 °C) and shows low volatility and minimal plate-out tendency. It generally maintains standard melt flow characteristics and does not significantly increase melt viscosity when incorporated at recommended dosage levels.
Q4: Is post-processing drying required before using LFR-8006 in polyamide compounds?
A: While LFR-8006 itself has low hygroscopicity, polyamide resins are highly moisture-sensitive. Therefore, standard drying protocols for the base polymer (e.g., 4–6 hours at 80 °C under dehumidified conditions) should still be followed prior to compounding or molding to ensure optimal mechanical performance and surface quality.
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