Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow Corning 62 Silicone Resin

Dow Corning® 62 Silicone Resin is a solvent-based, methyl-phenyl silicone resin offering excellent thermal stability, electrical insulation, and weather resistance. Designed for high-performance coatings, encapsulants, and release agents, it cures to a hard, glossy film with superior adhesion to metals and plastics. Widely used in aerospace, electronics, and industrial applications where durability under extreme conditions is critical.
  • dow corning 62 silicone resin_cf3b9112
  • dow corning 62 silicone resin_cf3b9112

Features Of Dow Corning 62 Silicone Resin

  1. High thermal stability with continuous service up to 200 °C.

  2. Excellent electrical insulation properties across wide temperature and frequency ranges.

  3. Good adhesion to metals, ceramics, and common industrial substrates without primers.

  4. Low intrinsic stress after cure, minimizing microcracking in thin-film applications.

  5. Solvent-based formulation (xylene/toluene blend) enabling compatibility with conventional coating equipment.

Typical Applications Of Dow Corning 62 Silicone Resin

  1. Electrical insulation coatings for motor windings and transformers.

  2. Heat-resistant protective topcoats for furnace components and exhaust systems.

  3. Binders for high-temperature ceramic and refractory coatings.

  4. Matrix resin in flexible silicone composites for aerospace gasketing.

  5. Adhesive primer layer in multilayer thermal barrier systems.

Specifications Of Dow Corning 62 Silicone Resin

Chemical TypeMethyl-phenyl silicone resin
Product FormSolvent solution
AppearanceClear, colorless to pale yellow liquid
Primary ApplicationsHigh-temperature coatings, electrical insulation, binder systems
Key FeaturesThermally stable, electrically insulating, solvent-processable
BenefitsEnhanced dielectric strength, dimensional stability at elevated temperatures, good film-forming capability
VOC ContentApprox. 75–80 wt% (solvent-based)
Curing MechanismThermal condensation (requires heat >150 °C for full crosslinking)


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