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High-performance, solvent-based silicone release coating offering excellent release consistency across diverse substrates.
Fast-drying formulation enables high-speed web processing and reduced line downtime.
Provides controlled, repeatable release force—ideal for medium-to-low adhesion applications.
Excellent thermal stability supports curing at standard industrial oven temperatures (120–180 °C).
Compatible with common gravure, flexographic, and reverse-roll coating equipment.
Release liners for pressure-sensitive adhesive tapes and labels.
Backing materials in medical transdermal drug delivery systems.
Protective release coatings for graphic arts films and decorative laminates.
Interleaf sheets in composite manufacturing and rubber processing.
Release treatment for paper, film, and foil substrates in packaging converting.
| Chemical Type | Platinum-catalyzed methylphenyl silicone polymer |
| Product Form | Solvent-based liquid coating (toluene/xylene blend) |
| Appearance | Clear, colorless to pale yellow liquid |
| Primary Applications | Medium-release liner systems for PSA products |
| Key Features | Controlled release, thermal curability, substrate versatility |
| Benefits | Process efficiency, consistent performance, broad compatibility |
| VOC Content (typical) | ~650 g/L (as supplied) |
| Recommended Cure Conditions | 130–160 °C for 30–90 seconds (web speed dependent) |
Q1: What substrates is DOWSIL 20 typically applied to?
A: DOWSIL 20 is commonly used on flexible packaging films (e.g., PET, OPP, PE), paper, and foil substrates. It provides reliable release performance for pressure-sensitive adhesives in labels, tapes, and medical device liners.
Q2: How is DOWSIL 20 cured, and what are typical processing conditions?
A: DOWSIL 20 is a platinum-catalyzed addition-cure silicone that requires thermal curing—typically at temperatures between 120 °C and 180 °C for several seconds to minutes, depending on line speed and substrate thermal stability. UV-assisted cure is not applicable.
Q3: Is DOWSIL 20 compatible with common solvent-based and water-based coating systems?
A: Yes, DOWSIL 20 is formulated for compatibility with both solvent-based and aqueous carrier systems. It can be diluted with aromatic or aliphatic solvents (e.g., toluene, hexane) or water-based emulsions, though formulation stability should be verified during scale-up.
Q4: Does DOWSIL 20 require post-cure treatment to achieve full release performance?
A: Full release performance is generally achieved after standard thermal cure; however, extended dwell time at elevated temperature or mild post-cure may enhance long-term aging resistance and release consistency—especially in high-performance adhesive applications.
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E-mail: wangxingqiang@ericwchem.com
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