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Two-part, platinum-catalyzed addition-cure silicone elastomer blend offering excellent flow and air release for complex mold filling.
Low viscosity before cure enables precise metering, dispensing, and encapsulation of sensitive electronic components.
Provides outstanding thermal stability and long-term reliability across a wide operating temperature range (–60 °C to 200 °C).
Delivers high dielectric strength and low ionic impurity content, supporting demanding electrical insulation requirements.
Compatible with automated liquid silicone rubber (LSR) processing equipment for high-volume, repeatable manufacturing.
Encapsulation and potting of power electronics, including IGBT modules and EV inverters.
Sealing and bonding in LED lighting assemblies requiring UV resistance and thermal management.
Overmolding of sensors and connectors in automotive and industrial control systems.
Soft-touch functional coatings for medical device housings and wearable electronics.
Thermal interface materials (TIMs) where conformability and low stress on underlying substrates are critical.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer blend |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance | Clear to translucent, low-viscosity liquids |
| Primary Applications | Encapsulation, potting, overmolding, and sealing in electronics and automotive |
| Key Features | Low viscosity, excellent air release, thermal stability, high dielectric strength |
| Benefits | Reduced void formation, improved process efficiency, long-term reliability under thermal cycling |
| Cure System | Addition cure (hydrosilylation) |
| Storage Stability | ≥12 months at 25 °C (unopened, original packaging) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
