High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to glass, aluminum, and painted metal substrates.
Low modulus formulation provides superior flexibility and stress relief for bonded assemblies subject to thermal cycling or vibration.
Excellent resistance to UV radiation, ozone, and extreme temperatures (–40 °C to +150 °C continuous service).
Non-corrosive cure chemistry — acetoxy-free, eliminating risk of corrosion to sensitive electronics and metals.
Good flow and self-leveling properties for consistent bead formation and gap-filling capability up to 6 mm.
Structural bonding of architectural glazing systems, including insulating glass units (IGUs) and curtain walls.
Sealing and bonding in solar photovoltaic module assembly, especially frame-to-glass and junction box attachments.
Automotive lighting assembly, including headlamp and taillamp lens bonding where optical clarity and long-term durability are critical.
Electronic enclosures and sensor housings requiring environmental sealing and mechanical stability under thermal stress.
Appliance manufacturing for bonding glass panels, control interfaces, and decorative trim components.
| Chemical Type | One-part, moisture-curing silicone polymer |
| Product Form | Paste-like, thixotropic paste in cartridge |
| Appearance | Translucent, off-white to light gray |
| Primary Applications | Structural glazing, solar module assembly, lighting, electronics sealing |
| Key Features | Low modulus, non-corrosive cure, UV/ozone resistant, flexible bond line |
| Shore A Hardness (7 days, 23°C/50% RH) | 25–35 |
| Cure Speed (Surface Dry Time) | ~20–30 minutes (23°C/50% RH) |
| Operating Temperature Range | –40 °C to +150 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China