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High thermal conductivity (1.7 W/m·K) for efficient heat dissipation in power electronics.
Room-temperature vulcanization (RTV) with condensation cure mechanism—no byproduct interference in sensitive assemblies.
Excellent electrical insulation properties and dielectric stability over wide temperature range (–50 °C to 200 °C).
Low modulus and high conformability enable stress-relief bonding on mismatched CTE substrates.
UL 94 V-0 rated for flame retardancy without halogen additives.
Thermal interface material (TIM) for IGBT modules and power semiconductor packages.
Encapsulation and potting of LED drivers and AC/DC converters.
Gap-filling adhesive for battery module thermal management in EV powertrains.
Die-attach and underfill in high-reliability automotive electronics.
Thermally conductive gasketing for server power supplies and 5G base station RF units.
| Chemical Type | Condensation-cure silicone rubber |
| Product Form | Two-component liquid (Part A: base; Part B: catalyst) |
| Appearance | Opaque gray paste (Part A), translucent amber liquid (Part B) |
| Primary Applications | Thermal interface materials, encapsulation, gap filling |
| Key Features | High thermal conductivity, low modulus, RTV cure, UL 94 V-0 |
| Shore A Hardness (7 days, 25 °C) | 25 ± 3 |
| Density (g/cm³) | 1.85 ± 0.05 |
| Operating Temperature Range | –50 °C to +200 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
