Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow SILASTIC RTV-4130-J Silicone Base and Curing Agent

Dow SILASTIC RTV-4130-J is a two-part platinum-cured silicone elastomer system offering excellent thermal stability, low compression set, and outstanding electrical insulation. Ideal for aerospace, automotive, and electronics sealing/encapsulation, it cures at room temperature with precise 1:1 mix ratio, delivering high tear strength and long-term reliability across extreme conditions.
  • dow silastic rtv 4130 j silicone base and curing agent_a65a0238
  • dow silastic rtv 4130 j silicone base and curing agent_a65a0238

Features Of Dow SILASTIC RTV-4130-J Silicone Base and Curing Agent

  1. Two-part, addition-cure silicone system offering excellent thermal stability and long-term reliability.

  2. Low viscosity base component enables easy mixing and efficient air release for void-free casting.

  3. Fast room-temperature cure with minimal exotherm, suitable for sensitive electronic assemblies.

  4. UL 94 V-0 rated after full cure, supporting flame-retardant design requirements.

  5. Excellent electrical insulation properties and stable dielectric performance across wide temperature and humidity ranges.

Typical Applications Of Dow SILASTIC RTV-4130-J Silicone Base and Curing Agent

  1. Encapsulation and potting of power electronics, including IGBT modules and DC-DC converters.

  2. Protective coating for automotive sensors exposed to high under-hood temperatures.

  3. Insulation and bonding in renewable energy systems such as solar inverters and battery management units.

  4. Sealing and gasketing in industrial control equipment requiring chemical resistance and dimensional stability.

Specifications Of Dow SILASTIC RTV-4130-J Silicone Base and Curing Agent

Chemical TypePlatinum-catalyzed addition-cure silicone elastomer
Product FormTwo-component liquid system (Base + Curing Agent)
AppearanceBase: translucent light amber liquid; Curing Agent: colorless to pale yellow liquid
Mix Ratio (by weight)10 : 1 (Base : Curing Agent)
Cure Schedule24 hours at 25°C or 2 hours at 80°C
Hardness (Shore A)40–45 after full cure
Density (g/cm³)Approx. 1.05–1.10
Primary ApplicationsElectronics encapsulation, thermal management, and environmental protection


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