Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow SILASTIC RTV-4135-L Silicone Rubber

Dow SILASTIC RTV-4135-L is a two-part platinum-cured liquid silicone rubber from Dow’s SILASTIC® portfolio offering excellent flow, low viscosity, and high tear strength—ideal for precision molding of medical devices, seals, and gaskets requiring biocompatibility and thermal stability.
  • dow silastic rtv 4135 l silicone rubber_e8520124
  • dow silastic rtv 4135 l silicone rubber_e8520124

Features Of Dow SILASTIC RTV-4135-L Silicone Rubber

  1. Two-part, addition-cure liquid silicone rubber with low viscosity for excellent flow and air release.

  2. Fast room-temperature cure (RTV) with minimal shrinkage and excellent dimensional stability.

  3. Outstanding thermal stability—retains mechanical properties from –55 °C to 200 °C continuously.

  4. Excellent electrical insulation properties and high dielectric strength for demanding electronic applications.

  5. Low compression set and superior resistance to aging, ozone, and UV exposure.

Typical Applications Of Dow SILASTIC RTV-4135-L Silicone Rubber

  1. Encapsulation and potting of sensitive electronic components including sensors, transformers, and power modules.

  2. Sealing and gasketing in automotive powertrain and EV battery systems.

  3. Insulating coatings for high-voltage connectors and busbar assemblies.

  4. Molded parts for medical device housings requiring biocompatibility support (ISO 10993-tested base formulation).

  5. Thermal interface materials (TIM) in LED lighting and power electronics where long-term reliability is critical.

Specifications Of Dow SILASTIC RTV-4135-L Silicone Rubber

Chemical TypePlatinum-catalyzed addition-cure liquid silicone rubber
Product FormTwo-component (Part A + Part B), liquid
Appearance (Mixed)Translucent, viscous liquid
Shore A Hardness (7 days @ 23°C)35 ± 3
Tensile Strength (ASTM D412)8.5 MPa (typical)
Elongation at Break (ASTM D412)450% (typical)
Density (ASTM D1475)1.12 g/cm³ (typical)
Primary ApplicationsElectronics encapsulation, thermal management, and high-reliability sealing


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