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Rapid room-temperature cure (tack-free in ≤30 minutes, full cure in ≤24 hours) without requiring heat or humidity.
Excellent flexibility and elongation (>100%) with low modulus, enabling stress relief in delicate assemblies.
Outstanding thermal stability across –55 °C to +200 °C after full cure.
Superior electrical insulation properties and dielectric strength for high-reliability electronic encapsulation.
Low viscosity before mixing (Part A and Part B), ensuring easy dispensing, degassing, and void-free casting.
Encapsulation and potting of sensitive electronic components including sensors, PCBs, and LED modules.
Prototyping and rapid tooling for soft silicone molds in R&D and low-volume manufacturing.
Conformal coating and protective overmolding of microelectromechanical systems (MEMS) and flexible circuits.
Sealing and gasketing of optical housings and medical device enclosures requiring biocompatibility support.
Dielectric isolation layers in power electronics and high-voltage sensor assemblies.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid kit (Part A: base; Part B: catalyst) |
| Appearance (Mixed) | Translucent, low-viscosity liquid |
| Mix Ratio (by weight) | 10:1 (Part A : Part B) |
| Cure Mechanism | Room-temperature addition cure (no by-products) |
| Shore A Hardness (24h, 23°C) | 40–45 |
| Elongation at Break (ASTM D412) | >110% |
| Density (g/cm³, 25°C) | 1.08–1.12 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
