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Halogen-free formulation meeting stringent RoHS and REACH compliance requirements.
Excellent thermal stability with decomposition onset above 300 °C.
Maintains high glass transition temperature (Tg) of cured epoxy systems without compromising mechanical strength.
Good compatibility with standard DGEBA-type epoxy resins and common hardeners.
Enables UL 94 V-0 rating at low additive loading (typically 15–20 wt% in formulated resin).
Printed circuit board (PCB) laminates requiring high flame retardancy and dimensional stability.
Electrical encapsulation compounds for power modules, transformers, and LED drivers.
Composite matrices in aerospace interior components meeting FAR 25.853 smoke and toxicity standards.
High-performance adhesives for electronics assembly and electric vehicle battery module bonding.
Structural potting resins used in industrial control cabinets and renewable energy inverters.
| Chemical Type | Phosphorus-based reactive flame retardant (DOPO derivative) |
| Product Form | Off-white to light yellow crystalline solid |
| Appearance | Free-flowing crystalline powder |
| Primary Applications | Reactive flame retardant for epoxy thermosets |
| Key Features | Halogen-free, low volatility, minimal impact on viscosity |
| Benefits | Improved char formation, reduced heat release rate (HRR), enhanced LOI |
| Storage Conditions | Store in cool, dry place; protect from moisture and direct sunlight |
| Shelf Life | 24 months under recommended storage conditions |
Q1: How does this flame retardant work in epoxy resin systems?
A: It functions primarily through condensed-phase mechanisms—promoting char formation and reducing volatile combustible decomposition products during thermal exposure. Its chemical structure is designed to integrate well with epoxy matrices without significantly compromising crosslink density or mechanical integrity.
Q2: Is it compatible with common epoxy curing agents like DDM, DDS, or anhydrides?
A: Yes—it demonstrates broad compatibility with aromatic diamines, dicyandiamide, and anhydride-type hardeners. No significant adverse interactions or premature gelation have been observed under standard processing conditions.
Q3: Does it affect the electrical insulation properties of cured epoxy?
A: When incorporated at typical usage levels, it maintains excellent dielectric strength and volume resistivity—making it suitable for high-voltage encapsulation and printed circuit board laminates where both flame resistance and electrical performance are critical.
Q4: Can it be used in halogen-free formulations?
A: Yes—this product is specifically engineered as a non-halogenated flame retardant, supporting compliance with environmental and regulatory expectations for low-smoke, low-toxicity applications.
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