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Halogen-free formulation meeting stringent RoHS and REACH compliance requirements.
Excellent thermal stability with decomposition onset above 300 °C.
Maintains high glass transition temperature (Tg) of cured epoxy systems without compromising mechanical strength.
Good compatibility with standard DGEBA-type epoxy resins and common hardeners.
Enables UL 94 V-0 rating at low additive loading (typically 15–20 wt% in formulated resin).
Printed circuit board (PCB) laminates requiring high flame retardancy and dimensional stability.
Electrical encapsulation compounds for power modules, transformers, and LED drivers.
Composite matrices in aerospace interior components meeting FAR 25.853 smoke and toxicity standards.
High-performance adhesives for electronics assembly and electric vehicle battery module bonding.
Structural potting resins used in industrial control cabinets and renewable energy inverters.
| Chemical Type | Phosphorus-based reactive flame retardant (DOPO derivative) |
| Product Form | Off-white to light yellow crystalline solid |
| Appearance | Free-flowing crystalline powder |
| Primary Applications | Reactive flame retardant for epoxy thermosets |
| Key Features | Halogen-free, low volatility, minimal impact on viscosity |
| Benefits | Improved char formation, reduced heat release rate (HRR), enhanced LOI |
| Storage Conditions | Store in cool, dry place; protect from moisture and direct sunlight |
| Shelf Life | 24 months under recommended storage conditions |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
