Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Ancamine 2771 Epoxy Curing Agent

Evonik Ancamine 2771 is a low-viscosity, aliphatic polyamine epoxy curing agent from Evonik’s Ancamine® series—designed for fast ambient-cure coatings, adhesives, and composites. It offers excellent flexibility, chemical resistance, and low exotherm. Ideal for demanding industrial applications requiring rapid turnaround and high performance.
  • evonik ancamine 2771 epoxy curing agent_0c6461c8
  • evonik ancamine 2771 epoxy curing agent_0c6461c8

Features Of Evonik Ancamine 2771 Epoxy Curing Agent

  1. Fast-reacting aliphatic amine curing agent enabling rapid demolding and high productivity in industrial manufacturing.

  2. Excellent low-temperature reactivity—effective cure initiation even at temperatures as low as 5 °C.

  3. Low viscosity (approx. 150–250 mPa·s at 25 °C) ensures easy handling, precise metering, and superior wetting of fillers and reinforcements.

  4. Provides outstanding mechanical properties in cured epoxy systems, including high hardness, impact resistance, and chemical resistance.

  5. Low volatility and reduced amine odor compared to conventional aliphatic amines—enhancing workplace safety and operator comfort.

Typical Applications Of Evonik Ancamine 2771 Epoxy Curing Agent

  1. Structural adhesives for automotive and aerospace assembly requiring fast fixture and high bond strength.

  2. Electrical encapsulation and potting compounds where thermal stability and dielectric performance are critical.

  3. High-performance flooring and industrial coatings demanding rapid return-to-service and abrasion resistance.

  4. Composite matrix resins for pultrusion and filament winding processes with short cycle time requirements.

  5. Repair mortars and grouts used in infrastructure maintenance under ambient or low-temperature conditions.

Specifications Of Evonik Ancamine 2771 Epoxy Curing Agent

Chemical TypeAliphatic polyamine
Product FormLiquid
AppearanceClear, pale yellow liquid
Primary ApplicationsEpoxy resin curing for adhesives, coatings, composites, and electrical encapsulation
Key FeaturesFast cure, low-temperature reactivity, low viscosity, low volatility
BenefitsImproved production efficiency, enhanced worker safety, excellent cured mechanical properties
Storage StabilityStable under dry, cool conditions (≤30 °C); protect from moisture and strong oxidizers


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