Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow D.E.H.85 Phenalkamine Epoxy Curing Agent

Dow D.E.H.85 Phenalkamine Epoxy Curing Agent is a bio-based, low-VOC amine hardener from Dow’s D.E.H. series. Designed for ambient-cure epoxy systems, it delivers rapid reactivity, excellent adhesion, and superior corrosion resistance—ideal for marine, industrial coatings, and composites where sustainability and performance intersect.
  • dow d.e.h.85 phenalkamine epoxy curing agent_c3e6fea8
  • dow d.e.h.85 phenalkamine epoxy curing agent_c3e6fea8

Features Of Dow D.E.H.85 Phenalkamine Epoxy Curing Agent

  1. Fast ambient-cure capability without external heat, enabling rapid turnaround in field applications.

  2. Excellent adhesion to damp, contaminated, or marginally prepared steel and concrete substrates.

  3. Superior corrosion resistance in aggressive marine and industrial environments.

  4. Low viscosity and favorable pot life for easy mixing and application by brush, roller, or spray.

  5. Phenalkamine chemistry provides enhanced flexibility and impact resistance versus conventional amines.

Typical Applications Of Dow D.E.H.85 Phenalkamine Epoxy Curing Agent

  1. Marine and offshore protective coatings for ballast tanks, decks, and splash zones.

  2. Industrial maintenance coatings for pipelines, storage tanks, and structural steel.

  3. Concrete repair and protective systems in wastewater treatment plants and chemical facilities.

  4. High-performance epoxy primers and intermediate coats in multi-layer coating systems.

  5. Field-applied corrosion protection for prefabricated infrastructure components.

Specifications Of Dow D.E.H.85 Phenalkamine Epoxy Curing Agent

Chemical TypePhenalkamine-based polyamine
Product FormLiquid
AppearanceAmber to reddish-brown viscous liquid
Primary ApplicationsAmbient-cure epoxy coatings and linings
Key FeaturesDamp-surface cure, low-temperature reactivity, corrosion inhibition
BenefitsReduced surface preparation, extended application window, improved service life
Compatible ResinsBisphenol-A and bisphenol-F epoxy resins
Storage ConditionsStore in original sealed container at 15–30°C; protect from moisture


Dow D.E.H.85 Phenalkamine Epoxy Curing Agent – Frequently Asked Questions (FAQ)

Q1: What are the key advantages of using D.E.H.85 over conventional amine curing agents?

A: D.E.H.85 offers enhanced reactivity at ambient temperatures, improved moisture tolerance during cure, and reduced volatility compared to many aliphatic amines—making it well-suited for demanding field applications where humidity control is limited.


Q2: Is D.E.H.85 compatible with standard bisphenol-A and bisphenol-F epoxy resins?

A: Yes, D.E.H.85 is broadly compatible with common liquid and solid epoxy resins, including bisphenol-A and bisphenol-F types, and delivers robust crosslinking performance across a range of molecular weights and epoxide equivalents.


Q3: How does D.E.H.85 perform in high-humidity or damp-surface conditions?

A: As a phenalkamine-based curing agent, D.E.H.85 exhibits superior adhesion and cure integrity on slightly damp or marginally contaminated steel and concrete substrates—commonly leveraged in marine, infrastructure, and maintenance coating systems.


Q4: What is the typical handling and storage guidance for D.E.H.85?

A: Store in original sealed containers at temperatures between 10–30°C, protected from moisture and direct sunlight. Ensure adequate ventilation during handling, and refer to the Safety Data Sheet (SDS) for detailed occupational hygiene and PPE recommendations.



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