Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Dynacoll S1606 Copolyester Resin

Evonik Dynacoll S1606 is a high-performance copolyester resin from the Dynacoll series, engineered for reactive hot-melt adhesives. It offers excellent thermal stability, fast setting, strong adhesion to polar substrates, and low melt viscosity. Widely used in automotive, packaging, and hygiene applications, it enables sustainable bonding without solvents or curing agents.
  • evonik dynacoll s1606 copolyester resin_9b88a9bf
  • evonik dynacoll s1606 copolyester resin_9b88a9bf

Features Of Evonik Dynacoll S1606 Copolyester Resin

  1. High thermal stability with excellent melt processability for extrusion and injection molding.

  2. Outstanding adhesion to polar substrates including PET, PA, and aluminum foil.

  3. Low-temperature sealing performance down to ~85 °C with strong hot-tack strength.

  4. Good chemical resistance against oils, greases, and common food simulants.

  5. Compliant with EU Regulation (EC) No. 10/2011 and FDA 21 CFR §177.1390 for food-contact applications.

Typical Applications Of Evonik Dynacoll S1606 Copolyester Resin

  1. Heat-seal layers in flexible packaging laminates for snacks and dried foods.

  2. Sealing layer in retortable pouches requiring steam-sterilization stability.

  3. Adhesive tie-layer in multilayer coextruded films for barrier packaging.

  4. Sealant resin for pharmaceutical blister lidding foils.

  5. Component in sustainable mono-material PE-based laminates for recyclability.

Specifications Of Evonik Dynacoll S1606 Copolyester Resin

Chemical TypeAliphatic-aromatic copolyester
Product FormPellets
AppearanceOff-white to pale yellow granules
Melt Flow Rate (MFR, 230 °C / 2.16 kg)12–16 g/10 min
Softening Point (Vicat, 50 N)92–98 °C
Density (23 °C)1.18–1.20 g/cm³
Primary ApplicationsFlexible packaging sealants and tie-layers
Key FeaturesLow-seal initiation, high hot-tack, food-contact compliant


Evonik Dynacoll S1606 Copolyester Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary function of Dynacoll S1606 in hot melt adhesive formulations?

A: Dynacoll S1606 functions as a reactive copolyester resin that enhances cohesive strength, heat resistance, and substrate adhesion—particularly on polar and difficult-to-bond surfaces—while maintaining good melt processability and open time.


Q2: Is Dynacoll S1606 compatible with common hot melt base polymers such as EVA, PO, and APAO?

A: Yes, Dynacoll S1606 demonstrates broad compatibility with ethylene-vinyl acetate (EVA), polyolefin (PO), and amorphous polyalphaolefin (APAO) systems, enabling formulation flexibility for tailored performance profiles without phase separation under standard processing conditions.


Q3: How does Dynacoll S1606 contribute to thermal stability in high-performance hot melts?

A: Its copolyester architecture provides improved thermal resistance compared to conventional polyester resins, supporting stable viscosity retention and reduced degradation during extended melt processing at elevated temperatures—typically up to 180–190 °C.


Q4: Can Dynacoll S1606 be used in food-contact or medical-grade adhesive applications?

A: Dynacoll S1606 is designed for industrial adhesive applications and may be considered for certain regulated uses subject to full formulation evaluation, regulatory review, and compliance verification by the end-user—Evonik does not provide pre-approval for specific food-contact or medical applications.



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