Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Dynacoll S1606 Copolyester Resin

Evonik Dynacoll S1606 is a high-performance copolyester resin from the Dynacoll series, engineered for reactive hot-melt adhesives. It offers excellent thermal stability, fast setting, strong adhesion to polar substrates, and low melt viscosity. Widely used in automotive, packaging, and hygiene applications, it enables sustainable bonding without solvents or curing agents.
  • evonik dynacoll s1606 copolyester resin_9b88a9bf
  • evonik dynacoll s1606 copolyester resin_9b88a9bf

Features Of Evonik Dynacoll S1606 Copolyester Resin

  1. High thermal stability with excellent melt processability for extrusion and injection molding.

  2. Outstanding adhesion to polar substrates including PET, PA, and aluminum foil.

  3. Low-temperature sealing performance down to ~85 °C with strong hot-tack strength.

  4. Good chemical resistance against oils, greases, and common food simulants.

  5. Compliant with EU Regulation (EC) No. 10/2011 and FDA 21 CFR §177.1390 for food-contact applications.

Typical Applications Of Evonik Dynacoll S1606 Copolyester Resin

  1. Heat-seal layers in flexible packaging laminates for snacks and dried foods.

  2. Sealing layer in retortable pouches requiring steam-sterilization stability.

  3. Adhesive tie-layer in multilayer coextruded films for barrier packaging.

  4. Sealant resin for pharmaceutical blister lidding foils.

  5. Component in sustainable mono-material PE-based laminates for recyclability.

Specifications Of Evonik Dynacoll S1606 Copolyester Resin

Chemical TypeAliphatic-aromatic copolyester
Product FormPellets
AppearanceOff-white to pale yellow granules
Melt Flow Rate (MFR, 230 °C / 2.16 kg)12–16 g/10 min
Softening Point (Vicat, 50 N)92–98 °C
Density (23 °C)1.18–1.20 g/cm³
Primary ApplicationsFlexible packaging sealants and tie-layers
Key FeaturesLow-seal initiation, high hot-tack, food-contact compliant


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